| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable double-sided wiring board in which layers can be connected surely to each other without lowering the wiring density in the vicinities of interlayer connections. SOLUTION: This double-sided wiring board is manufactured through a step of forming via holes in an insulating layer having a two-layer structure of an insulating layer and first metal foil, a step of forming conductor posts by electroplating by using the first metal foil as a lead for electroplating, and a step of forming a metallic material for joining on the surfaces of the conductor posts. Then a step of forming an adhesive layer on at least either one of the surfaces of the insulating layer and second metal foil, a step of joining the conductor posts to the second metal foil with the metallic material for joining while the adhesive layer is removed and, in addition, sticking the insulating layer and second metal foil to each other with the adhesive layer, and a step of forming a wiring pattern by etching the first and second metal foil, are performed. |
