CIRCUIT BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To achieve reliable flip-chip mounting. SOLUTION: The circuit board 10 has an insulating board 11, a circuit pattern 22 formed on one main surface of the insulating board 11, a metal bump 17 for junction formed on a circuit pattern 22 to join an electrode pad provided on one main surface of a semiconductor chip to the circuit pattern 22, and an alignment marks 18 formed on the other of the insulating board 11 for utilizing in alignment when the semiconductor chip is subjected to the flip-chip packaging. The manufacturing method of the circuit board 10 includes a process for forming a resist pattern by the photolithography technique using a single photo mask having a pattern corresponding to both the metal bump 17 for junction and an alignment marks 18, and a process for utilizing the resist pattern to simultaneously form both the metal bump 17 for junction and the alignment marks 18.