METHOD FOR FORMING BUMP ON WAFER OR SUBSTRATE

摘要

PURPOSE: A method for forming a bump on a wafer or a substrate is provided to reduce a fabrication cost by simplifying a fabrication process for forming the bump. CONSTITUTION: A UBM layer(12) is formed on an electrode pad(11) located on an upper surface of a wafer(1). A heat-resistant and steady synthetic tape is adhered on the upper surface of the wafer(1). A hole passing the heat-resistant and steady synthetic tape is formed by using a laser beam. A blind hole is formed on the heat-resistant and steady synthetic tape of the UBM layer(12). The blind hole is filled with solder paste by using a pusher. The solder paste is melted and cooled by a solder block. The solder block is exposed by removing the heat-resistant and steady synthetic tape. A ball type solder bump is formed by melting and cooling the solder block.