| 摘要 |
PROBLEM TO BE SOLVED: To prevent corrosion of a wiring due to a battery effect by suppressing deposition of Cu. SOLUTION: When a Cu atom is deposited on the grain boundary of a metal wiring by a baking processing during a photolithography process or by the hot processing during a RIE process, etc., in working with a metal wiring comprising Al-Cu or Al-Si-Cu, the Cu on the grain boundary of the metal wiring forms solid solution again in the metal wiring through, for example, a hot pressure (for example, 300 deg.C or higher) and a cooling processing (cooling up to about 150 deg.C at cooling speed 1 deg.C/second or faster) just after the RIE processing. Then, by a chemical liquid processing and a pure water processing for removing a reactive product (residue) generated at the RIE, electrochemical reaction (battery effect) will not take place during the pure water processing, nor corrosion will occur at the metal wiring.
|
