发明名称 |
COOLING FAN |
摘要 |
PURPOSE: A cooling fan device is provided to enhance the standardization and productivity of work by improving an assembling structure of a heat sink and heat discharging fan. CONSTITUTION: The cooling fan comprises a heat sink(10) discharging heat transferred from an IC package by heat exchanging and a heat discharging fan(20) improving cooling efficiency by forcible convection operation by providing wind blow to the heat sink. The heat sink consists of a base having a plain lower surface in order to closely contact to a heat emitting surface of IC package and a cooling pin to rapidly discharge the heat transferred from the base to the atmosphere. The cooling pin is formed as a single body with the base and is formed in a lattice arrangement perpendicular to the base having a fixed space. The heat discharging fan uses a general motor having a blade(22) to generate wind blow. The heat sink and heat discharging fan is connected by simple insertion assembling without using a screw. The heat sink is equipped with a perpendicular cylindrical post(30) formed in a single body with the cooling pin at the corner. An insertion part(31) formed in the top of post is inserted to a connection part(36) of connection bracket(35).
|
申请公布号 |
KR20020026649(A) |
申请公布日期 |
2002.04.12 |
申请号 |
KR20000057861 |
申请日期 |
2000.10.02 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SON, BYEONG UK |
分类号 |
G06F1/20;(IPC1-7):G06F1/20 |
主分类号 |
G06F1/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|