发明名称 POLYMER-REMOVING APPARATUS AND METHOD THEREFOR USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a polymer-removing apparatus and a polymer removal method for preventing polymer from readhering to a wafer surface and for reducing the polymer on the wafer surface, by reducing the temperature of a cleaning liquid passing through the filtering section of a circulation filtering means, as compared with the temperature of the cleaning liquid at a cleaning treatment section. SOLUTION: This polymer-removing device has a contact means for bringing a contact liquid into contact with the polymer on a wafer to contain the polymer into the contact liquid, a cleaning tank 7, having cleaning liquid for removing the contact liquid on the wafer to carry out cleaning treatment, and a circulation filtration means for circulating and filtering the cleaning liquid. Also, a heater 14 is provided in a cooler 15 for cooling the cleaning liquid. prior to passing through a filtration section (filter) 13, and in the cleaning tank 7.
申请公布号 JP2002110617(A) 申请公布日期 2002.04.12
申请号 JP20000301964 申请日期 2000.10.02
申请人 MITSUBISHI ELECTRIC CORP 发明人 SHONO TOMOTAKA;NAKAOKA YASUYUKI
分类号 B08B3/08;B08B3/10;B08B3/12;H01L21/304;H01L21/306;(IPC1-7):H01L21/304 主分类号 B08B3/08
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