| 摘要 |
PROBLEM TO BE SOLVED: To provide electronic equipment which enables packaging, reducing man-hours, such as a mount process, superior in reliability and easy at a low cost by utilizing the characteristic of wafer batch processing, dispensing with a mother board and the packaging using till now, and performing cutting after pseudo-wafers are collectively mounted in batch on a wiring board having the similar functions as this. SOLUTION: An adhesive sheet 2 is stuck on the board 1, a plurality of nondefective bare chips are fixed on the adhesive sheet 2 by setting the face of the A1 electrode pad 5 upside down, a resin 4 is adhered on the whole face including a part between the plurality of the good product bare chips 3, the pseudo-wafer 29 fixing the nondefective bare chips 3 are peeled, integrated with a pseudo mother board 80 providing corresponding wiring or the like, the resin 4 is cut between the nondefective bare chips 3 to separate each nondefective chip module 82, and electronic equipment is made, by using it. |
