| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which reduces the concentration of stress on a bonding member connecting a semiconductor chip and a conductor member due to thermal stress. SOLUTION: An E heat sink 3 is bonded by solder to the top surfaces 1a and 2a of semiconductor chips 1 and 2, a 2nd conductor 5 is bonded by solder 4 to the backsides 1b and 2b, and a 3rd conductor member 6 is bonded by solder to the top surface 3a of the E heat sink 3. The E heat sink 3 is provided with a step part 3c to have a thin part 3d, and the bonding area between the E heat sink 3 and 3rd semiconductor member 6 is smaller than that between the E heat sink 3 and semiconductor chips 1 and 2. The respective members 1 to 8 are sealed with resin so that the backside 5b of the 2nd conductor member 5 and the top surface 6a of the 3rd conductor member 6 are exposed. |
