发明名称 MANUFACTURING METHOD OF FEED THROUGH SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To provide a manufacturing method of feed through substrates, which coats accurately and efficiently a resin on the stepped parts of the feed through substrates for preventing a short of the patterns of the substrates from being generated. SOLUTION: The manufacturing method of feed through substrates has: a first step that a plurality of ceramic green sheets 20a to 20d are laminated and a laminate 20 having recesses 26, which are used as the stepped parts 34 of a plurality of the feed through substrates 10, is fired to form sheetlike substrates 27; a second step that resins 28 are applied in the recesses 26 and dried, respectively; a third step that the substrates 27 are cut in one direction to form rectangular substrates 29; a fourth step that metallizing pastes 32 and 33 are applied on cut surfaces 30 and 31, respectively, which are the side surfaces, which oppose to the substrates 10, of the substrates 29 and the cut surfaces 30 and 31 are fired; and a fifth step that the substrates 29 are cut in the rectangular direction to the cut surfaces 30 and 31 to form individual pieces of the substrates 10.</p>
申请公布号 JP2002110846(A) 申请公布日期 2002.04.12
申请号 JP20000297001 申请日期 2000.09.28
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 ITAKURA HIDEAKI
分类号 H01L23/12;H01L23/02;(IPC1-7):H01L23/12 主分类号 H01L23/12
代理机构 代理人
主权项
地址