发明名称 WIRING BOARD AND ITS MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To reduce electric resistance in a through hole conductor where a connection pin is not inserted, and to provide a wiring board that can be sufficiently utilized as a circuit for power supplies or for ground. SOLUTION: This wiring board 1 has an insulating layer 2 having front and back surfaces 6 and 7, a plurality through holes 8 passing between the front and back surfaces 6 and 7 in the insulating layer 2, and first and second through hole conductors 10a and 10b that are separately formed in the plurality of through holes 8 and at the same time have a hollow section 11 along an axis center. In this case, a connection pin 20 connecting to the outside is inserted into the hollow section 11 of the first through hole conductor 10a, and a dummy pin 21 that is not connected to the outside is inserted into the hollow section 11 of the second through hole conductor 10b.</p>
申请公布号 JP2002111155(A) 申请公布日期 2002.04.12
申请号 JP20000294626 申请日期 2000.09.27
申请人 NGK SPARK PLUG CO LTD 发明人 NAKAGAKI SHINJI
分类号 H05K1/11;H05K3/40;H05K3/46;(IPC1-7):H05K1/11 主分类号 H05K1/11
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