| 摘要 |
<p>PROBLEM TO BE SOLVED: To achieve a printed-wiring board that has a high inductance component by a wiring pattern without nearly changing the material and manufacturing process of a current multilayer printed-wiring board. SOLUTION: A hole 6 is provided on the printed-wiring board 1. The hole 6 is filled with a magnetic material 12 such as ferrite. A wiring pattern 10 forms a loop around the hole 6. The wiring pattern 10 for forming the loop is provided at the inner layer of the multilayer printed-wiring board.</p> |
