| 摘要 |
PROBLEM TO BE SOLVED: To provide a disc-shaped heater and a heating device as well as a wafer processing device which can easily correct changes of temperature distribution die to external environment. SOLUTION: With the disc-shaped heater 1 provided with a disc-shaped ceramic base body 2 and heating resistors 4, 5, 8 buried inside the ceramic base body 2, the heating resistors 4, 5, 8 consist of a plurality of circular-arc outside main heating elements 4 formed in concentric circles at an outer periphery of the disc-shaped ceramic base body 2, a plurality of circular-arc inside main heating elements 5 formed in concentric circles inside the outside main heating elements 4, and auxiliary heating elements 8 formed in the vicinity of the outside main heating elements 4 and/or the inside main heating elements 5, and at the same time, the outside main heating elements 4 and the inside main heating elements 5 constitute a Wheatstone bridge circuit.
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