发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device for which the deterioration of electric characteristics is suppressed, and to provide a method of manufacturing the device. SOLUTION: The method of manufacturing the semiconductor device includes a step of forming a gate insulating layer 20 and a silicon layer 32 on a semiconductor layer 10, a step of forming sidewall insulating layers 62 on the sides the silicon layer 32, and a step of forming a planarized first insulating layer 50. The method also includes a step of forming a recessed section 80, by removing the silicon layer 32 so that the gate insulating layer 20 is not exposed, a step of partially filling the recessed section 80 with a metal layer 60, and a step of forming a second insulating layer 60 in the recessed section 80. In addition, the method also includes a step of forming a through-hole 90a by etching the first insulating layer 50 and step of forming a contact layer 92a in the through-hole 90a. The second insulating layer 60 and sidewall insulating layers 62 are made of materials, which are different from that of the first insulating layer 50.
申请公布号 JP2002110966(A) 申请公布日期 2002.04.12
申请号 JP20000292142 申请日期 2000.09.26
申请人 SEIKO EPSON CORP 发明人 KASUYA YOSHIKAZU
分类号 H01L29/43;H01L21/336;H01L21/60;H01L29/423;H01L29/49;H01L29/78;(IPC1-7):H01L29/78 主分类号 H01L29/43
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