| 摘要 |
PROBLEM TO BE SOLVED: To prevent cross talk of signals between adjacent inductors from becoming larger even when the size of an inductor array is further reduced for high-density mounting. SOLUTION: The inductor array is manufactured by laminating an upper ground plane 11 composed of a green ferrite sheet carrying a ground pattern 17 formed on its upper surface, a conductor plane 12 composed of a green ferrite sheet carrying a conductor pattern 18 formed on its upper surface, and a lower ground plane 13 composed of a green ferrite sheet carrying a ground pattern 14 formed on its upper surface upon another and baking the laminated body.
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