| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting an electronic component having a board lower surface receiving mechanism capable of dealing with a board of a different size by a simplified mechanism. SOLUTION: The apparatus for mounting the electronic component mounts the component on a board 3 by a mounting head 4. The apparatus comprises a base 6 having a board lower surface receiver 5 for supporting a lower surface of the board 3 by a lower surface receiving pin 9 at a board positioning unit 1 and vertically movably arranged by a cylinder 7 of a single vertically moving means, and a plurality of lower surface receiving units 8A and 8B detachably mounted on the base 6 and having the pin 9 stood thereon. When the lower surface of the board 3 is supported from its lower surface, the units 8A and 8B are attached or detached in response to the size of the board 3 to be an object. Thus, the board lower surface receiving mechanism can be simplified. |
