MULTILAYER INTERCONNECTION BOARD

摘要

PROBLEM TO BE SOLVED: To provide a multilayer interconnection board having a structure that has high strength and is highly reliable. SOLUTION: In the multilayer interconnection board where a plurality of wiring sheets having a porous sheet, and a conductive pattern where a conductive substance is filled into a void at the selected region of the porous sheet are laminated, at least two types of porous sheets with a different average void diameter are used as the porous sheets for composing the plurality of wiring sheets.