| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrasonic wave sensor that can simply be manufactured. SOLUTION: The ultrasonic wave sensor is provided with a sensor case 2 having a sound source part 4 that transmits and/or receives an ultrasonic wave through vibration, a piezoelectric vibration element 1 provided in the inner face of the sound source part 4 of the sensor case 2, and a board 5 having lead electrodes L1, L2 on the board face and the lead electrodes L1, L2 that are connected to electrodes of the piezoelectric vibrating element and contained in the sensor case.
|
