| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit unit which is suitably made small-sized and has superior high-frequency characteristics. SOLUTION: On an alumina substrate 1, capacitors C1 to C3 and a wiring pattern P are formed in a thin film and part of the wiring pattern P is used as a connection land 5 to mount a bare chip 6 of a transistor Tr. Here, the upper electrode 4 of the capacitor C2 among the capacitors C1 to C3 is used as part of the connection land 5 and a collector electrode 6a on the bottom face of the bare chip 6 is connected onto the connection land 5 by using a conductive adhesive 7. The upper electrodes of the remaining capacitors C1 and C3 are used as bonding pads and a base electrode 6b and an emitter electrode 6c on the top surface of the bare chip 6 are connected to the upper electrodes 4 of the capacitors C1 and C3 by using a wire 8.
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