发明名称 |
Method for bonding substrates |
摘要 |
A method for bonding substrates to tightly bond two overlaid substrates comprises the steps of: aligning the substrates, freely falling a second substrate onto a first substrate to overlay the first and second substrates; interposing an air layer between the joining surfaces of the first and second substrates, aligning the first and second substrates and holding the aligned first and second substrates; and pressing one point of the aligned two substrates. Thus, the bonded substrates which can be aligned accurately and free from occurrence of voids or the like can be obtained.
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申请公布号 |
US2002040754(A1) |
申请公布日期 |
2002.04.11 |
申请号 |
US20010972851 |
申请日期 |
2001.10.10 |
申请人 |
TOMITA SHINICHI;TSUDA SHUHEI;IKEDA YASUNOBU |
发明人 |
TOMITA SHINICHI;TSUDA SHUHEI;IKEDA YASUNOBU |
分类号 |
H01L27/12;H01L21/02;H01L21/762;(IPC1-7):B32B31/00 |
主分类号 |
H01L27/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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