发明名称 |
Process for the production of composite ceramic printed wiring board |
摘要 |
A process for the production of a composite ceramic printed wiring board, comprising (1) making a penetration hole having a diameter of 0.1 to 0.8 mm in a ceramic board having an open porosity of at least 5% and a thickness of 0.1 to 10 mm, (2) fixing metal (M) to the penetration hole such that the metal (M) penetrates through the penetration hole, (3) impregnating a heat-resistant resin precursor (R) under vacuum, polymerizing the heat-resistant resin precursor (R) and polishing both surfaces of the resultant board to produce a resin composite ceramic substrate (MRA) having a conductive portion for conduction between both surfaces in a predetermined portion, and (4) forming printed wiring networks on one or both surfaces of the resin composite ceramic substrate (MRA).
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申请公布号 |
US2002040522(A1) |
申请公布日期 |
2002.04.11 |
申请号 |
US20010920636 |
申请日期 |
2001.08.03 |
申请人 |
OHYA KAZUYUKI;SAYAMA NORIO;NOBUKUNI TAKESHI |
发明人 |
OHYA KAZUYUKI;SAYAMA NORIO;NOBUKUNI TAKESHI |
分类号 |
H05K3/40;H05K1/03;H05K3/00;H05K3/46;(IPC1-7):H05K3/02;H05K3/20 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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