| 摘要 |
Multi-modal soldering inspection system comprises means for automatic inspection involving imaging means for acquiring solder joint images, mode-selecting means for selecting auto mode, review mode, or eye mode, means for integrating inspection data obtained in the auto and the review modes, replay means for replaying images acquired with the imaging means to display them, input means for inputting the review data, and storage for storing the inspection data. The multi-modal soldering inspection system works in two or three modes wherein, at first in the auto mode, the system performs automatic inspection of solder joints of a printed circuit board (PCB) and stores addresses and/or images of suspect points tentatively judged as defective in the automatic inspection, next in the review mode, the system reacquires or replays images of the suspect points to display them with markers superimposed thereon so that an operator can carry out the verification by looking at the displayed images, and finally in the eye mode, the system displays a PCB map indicating addresses of points for visual inspection so that an operator can carry out direct visual inspection of the PCB referring to the map and accomplish the total inspection by inputting the visual inspection data.
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