发明名称 |
Interconnections for a semiconductor device and method for forming same |
摘要 |
A method for forming an electrical contact for a semiconductor device comprises the steps of providing a semiconductor wafer section having a major surface with a plurality of conductive pads thereon and electrically coupling each pad with an elongated electrical interconnect. Next, each electrical interconnect is encased in a dielectric and the dielectric is sectioned to expose a portion of each interconnect. An inventive structure which can be formed by the inventive method is also described. |
申请公布号 |
US2002041034(A1) |
申请公布日期 |
2002.04.11 |
申请号 |
US20010015337 |
申请日期 |
2001.12.11 |
申请人 |
MODEN WALTER L.;KINSMAN LARRY D.;FARNWORTH WARREN M. |
发明人 |
MODEN WALTER L.;KINSMAN LARRY D.;FARNWORTH WARREN M. |
分类号 |
H01L23/31;H01L23/485;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/31 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|