A TESTING DEVICE FOR SEMICONDUCTOR COMPONENTS AND A METHOD OF USING THE DEVICE

摘要

A testing device (10) for semiconductor components and a method of making the device is described. The testing device (10) includes a support structure (20) having an outer edge, and an adhesive film (30) disposed on the support structure (20) to hold a semiconductor wafer (50) in position on the support (20) structure so that neither the adhesive film (30) nor the semiconductor wafer (50) extends beyond the outer edge of the support structure (20). Between the support structure (20) and the adhesive film (30) is a mesh layer (25). A vacuum chuck (42) may be used.