摘要 |
Disclosed is a wire bonding apparatus which has a structure as simple and as light as possible, which substantially reduces the inertia in a Z-direction rotating portion swinging at a high speed in the Z-direction, and which can realize a stable high-speed swinging of the Z-direction rotating portion while restraining vibration. A wire bonding apparatus (21) is arranged on a base capable of moving in X- and Y-directions by an XY stage, and is equipped with a wire clamp (22) rotatable in the Z-direction perpendicular to the X- and Y-directions. A driving portion (15) imparts a wire gripping force to the wire clamp. An elastic sack-like member (14) is arranged on the wire clamp and adapted to change its shape by a fluid introduced by the driving portion (15) through a tube (23), to thereby generate a wire gripping force.
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