| 摘要 |
Parallel surfaces are interfacially mechanically bonded and optionally electrically, and/or thermally connected using an interposer (10) fabricated from a flexible laminates, such as flex PWB (12). The bond/connection points (30) for the device made on side of the interposer (10) are displaced in the X and Y axis from the bond/connection points (30) on the other or obverse side for the interposer (10) and the board (12). The optional electrical/thermal connection through the interposer (10) is made through one or more traces (13) and vias (16, 18) in the flex board (12). |
