发明名称 Power supply device for enhancing heat-dissipating effect
摘要 A packing structure of a switching power supply is used for enhancing heat-dissipating effect. The packing structure includes a printed circuit board, a transformer, an inductor having an inductive winding, a converter placed on a pad of the printed circuit board, wherein the pad is electrically connected to a secondary winding of the transformer and the inductive winding, and a metal cover directly covered on the converter.
申请公布号 US2002041506(A1) 申请公布日期 2002.04.11
申请号 US20010791257 申请日期 2001.02.22
申请人 CHEN KUN-FENG;HSIEH YI-HWA;HSIAO KO-YU 发明人 CHEN KUN-FENG;HSIEH YI-HWA;HSIAO KO-YU
分类号 H02M3/00;H05K1/02;H05K1/16;H05K7/20;(IPC1-7):H02M1/00 主分类号 H02M3/00
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