发明名称 TRANSPARENT SUBSTRATE AND HINGED OPTICAL ASSEMBLY
摘要 A method and apparatus are provided for providing an electro-optic signal processing device. The method includes the steps of providing an optical transparent substrate (11) having first and second planar elements with abutting common edge, the planar elements lying at different angles with respect to each other about the common edge and a plurality of alignment apertures (26) formed in the substrate (11). A plurality of optical devices of an optical array are disposed on the first planar element of the substrate (11), with transmission paths of the optical devices passing directly through the substrate (11). A signal processor is also disposed on the first planar element of the substrate (11). An optical fiber holder (50) comprising a plurality of respective optical fibers (54) and guide pin apertures (52) disposed on a first surface of the optical fiber holder (54) is aligned to the optical array using the guide pins (28) and guide pin apertures (52). Optical signals of the optical devices of the optical array are coupled to respective optical fiber of the aligned fiber holder (50). A printed circuit board having a first surface is attached to a mating surface of the substrate's second planar element.
申请公布号 WO0229465(A1) 申请公布日期 2002.04.11
申请号 WO2001US29018 申请日期 2001.09.17
申请人 CORONA OPTICAL SYSTEMS, INC. 发明人 O'CONNOR, GARY;WICKMAN, RANDY;GREENE, JOHN;MANSUR, DANIEL, C.;BARNESON, DAVID;GREGORY, BRYAN
分类号 G02B6/42;H01L31/0232;H01S5/022;H05K1/00;H05K3/00 主分类号 G02B6/42
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