| 摘要 |
<p>The invention concerns a method for bonding a surface pre-machined by electrical discharge machining which consists, prior to bonding, in subjecting it to laser beam scanning and decontamination, in particular with pulsed laser beam, which causes deburring of the cracked low adherence layer produced by electrical discharge machining. When an assembly is produced by bonding on the resulting decontaminated surface, it does not exhibit any mechanical weakness nor incipient rupture, and is therefore more resistant.</p> |
