| 摘要 |
A semiconductor device is disclosed, which comprise a first semiconductor chip where a semiconductor element is formed, a first connecting terminal arranged on a semiconductor element formation surface side in the first semiconductor chip and connected electrically to the semiconductor element, a conductive member buried in a through hole that goes through the first semiconductor chip, a second connecting terminal arranged on a back surface side of the semiconductor element formation surface in the first semiconductor chip, and connected electrically to the semiconductor element via the conductive member, a wiring substrate to which the first semiconductor chip is mounted, and a third connecting terminal at least portion of which is formed at a position corresponding to one of the first connecting terminal and the second connecting terminal, and which is electrically connected to the one of the first connecting terminal and the second connecting terminal.
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