DISTRIBUTED THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC COMPONENTS

摘要

A distributed thermal management system for electronic components has a heat pipe, a first heat pump in thermal communication with the evaporator end of said heat pipe and a second heat pump in thermal communication with the condenser end of said heat pipe, said first heat pump adapted to withdraw heat from an electronic component and said second heat pump adapted to deliver said heat to an external heat sink. A controller is adapted to control the system such that said electronic component, said heat pipe, and said heat sink operate at below, approximately at, and above ambient temperature respectively. Also taught is an interface plate adapted to cool multiple electronic components using a single external heat sink. Also taught is a thermal diode located between the heat sink and the electronic component(s), and adapted to block the reverse flow of heat.