Photoempfindlicher Halbleiterbaustein und Herstellungsverfahren dafür

摘要

An object of the present invention is to prevent deterioration of adhesion between a molding resin and lead frame and a light transmission characteristic due to the attachment of a translucent resin to an upper surface of the lead frame upon charging a photocoupler with the translucent resin. A concave portion is defined in an island of a lead frame to which a photosensitive semiconductor device is fixed.