| 摘要 |
<p>The invention relates to a method for forming a self-aligned transition between a transmission line (1) and a module (2) to be connected to said transmission line (1). The invention equally relates to such a module (2), to such a transmission line (1), to an intermediate element (5) possibly to be positioned between such a module (2) and such a transmission line (1), and finally to a system comprising such a transition. In order to enable a simple and precise connection of a transmission line (1) with some other module (2), it is proposed to use matching solder particles (8) and soldering pads on module (2) and transmission line (1) or intermediate element (5) respectively, and to apply a reflow treatment to the joined elements (1) and (2) or (5) and (2), thereby forming a self-aligning connection. The invention is to be applied particularly to waveguide-to-microstrip transitions.</p> |
