| 摘要 |
<p>A card type recording medium capable of increasing a memory capacity, and being excellent in rigidity and excellent in impact resistance; and a production method therefor. Memory modules (221, 222, 270), constituted by mounting a plurality of memory chips (15) on memory substrates (21, 22, 70, 63, 65), are mounted on one surface of a base substrate (10), and IC chips (13, 14, 60) for controlling the operation of the above plurality of memory chips are mounted on the other surface of the base substrate, all the components being housed in a package (30, 31).</p> |
