发明名称 HIGH SPEED MULTI-STAGE STACKED LAYERS SWITCH
摘要 <p>A compact multi-stage data packet switching network (100), adapted for simultaneously routing data packets sets from input ports (110) to output ports (190) comprising: a first stack (140) of IC switching layers (113); a second stack (160) of IC switching layers (113), each IC switching layer (113) containing at least one switching element circuit (142);an interconnection (150) that connects the first stack (140) of IC switching layers (113) to the second stack of (160) of IC switching layers (113) to form the network (100), the interconnection (150) provides a natural full-mesh connection. IC superconducting and superconducting cooling are also used for providing high speed and low power operation.</p>
申请公布号 WO2002030069(A1) 申请公布日期 2002.04.11
申请号 US2001031583 申请日期 2001.10.09
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