Joining substrates involves pressing substrates together during rotation to form capillary gap in inner hole area as adhesive layer is forced radially outwards by centrifugal action

摘要

The method involves placing a first substrate (4) on a rotary plate (6), applying an adhesive (26) near the inner hole of the substrate, applying a second substrate (3) to the surface of the first substrate with the adhesive layer and rotating the substrates to force the adhesive radially outwards by centrifugal force. The two substrates are pressed together during rotation to form a capillary gap in the inner hole area. Independent claims are also included for the following: an arrangement for joining substrates.