发明名称 CURING RESIN COMPOSITION, CURED MATERIAL, ADHESIVE COMPOSITION, AND ADHERED MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a curing resin composition excellent in heat resistance, having a high curing speed, having good adhesiveness, and especially exhibiting excellent heat resistance when used for producing motors. SOLUTION: This curing composition contains (1) polymerizable vinyl monomers, (2) zeolite, and (3) a naphthenic acid metal salt. Further, the composition preferably contains (4) a thiourea derivative, (5) a curing agent, (6) elastomer components, and (7) an acidic phosphate compound. The composition may be used as the adhesive composition. The polymerizable vinyl monomers preferably comprise (a) an epoxy (meth)acrylate and (b) polymerizable vinyl monomers other than the epoxy (meth)acrylate.
申请公布号 JP2002105109(A) 申请公布日期 2002.04.10
申请号 JP20000297739 申请日期 2000.09.29
申请人 DENKI KAGAKU KOGYO KK 发明人 OTSUKA NOBUYUKI;HOSHINO HISAO;ONOZATO IKUYO
分类号 C08F2/44;C08F20/32;C09J4/06;(IPC1-7):C08F2/44 主分类号 C08F2/44
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