| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors excellent in adhesivity to various members such as a semiconductor element and a lead frame, soldering resistance on substrate mounting, and especially adhesivity to a preplating frame of Ni, Ni-Pd, Ni-Pd-Au or the like. SOLUTION: The epoxy resin composition for sealing semiconductors contains (A) an epoxy resin, (B) a phenol resin, (C) a compound of the general formula (1) and/or a hydrolysate of a compound of the general formula (1), (D) an inorganic filler and (E) a curing accelerator, as essential components.
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