发明名称 |
Wiring substrate and manufacturing method of the same along with electroless copper plating solution used therefor |
摘要 |
<p>Providing a multilayer wiring substrate high in connection reliability through process steps of forming more than one opening (3) such as a via-hole in a dielectric layer (2) laminated on a substrate (1) and then applying uniform copper plating (4) to a surface portion of the dielectric layer including the opening to thereby form a wiring layer. An electroless copper plating solution with at least one of mandelonitrile and triethyltetramine mixed therein is used to perform the intended electroless copper plating. An alternative way of performing such electroless copper plating is to make use of an electroless copper plating solution with chosen additive agents or "admixtures" containing at least one of mandelonitrile and triethyltetramine plus eriochrome black T along with at least one of 2,2'-bipyridyl, 1,10-phenanthroline, and 2,9-dimethyl-1,10-phenanthroline. <IMAGE></p> |
申请公布号 |
EP1196016(A2) |
申请公布日期 |
2002.04.10 |
申请号 |
EP20010123229 |
申请日期 |
2001.10.02 |
申请人 |
HITACHI, LTD. |
发明人 |
ITABASHI, TAKEYUKI;AKAHOSHI, HARUO;TAKAI, EIJI;NISHIMURA, NAOKI;IIDA, TADASHI;UEDA, YOSHINORI |
分类号 |
H05K1/02;C23C18/38;C23C18/40;H05K3/18;H05K3/42;H05K3/46;(IPC1-7):H05K3/42 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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