POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a positive type photosensitive resin composition excellent in wettability and ensuring controlled precipitating property of a polymer or additive and to provide a heat resistant pattern forming method using the composition. SOLUTION: The positive type photosensitive resin composition is prepared by dissolving (A) a hydroxypolyamide as a PBO precursor, (B) a photosensitive quinonediazido compound and (C) a silicon-containing surfactant having a specified structure (hydrophilic silicone oil) in a solvent and a heat resistant pattern is formed using the composition.