| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor capable of preventing a break of a bonding wire. SOLUTION: A sensor chip 1 is mounted on a glass spacer 2 fixed to the bottom face of a housing part in a resin case 3 by means of an adhesive 4, while the adhesive 4 is charged via a part or the whole of a clearance between the glass spacer 2 and the resin case 3. A metal terminal 5 insert-molded in the resin case 3 and the sensor chip 1 are connected to each other via the bonding wire 6 and coated with a gel type protective resin 7.
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