Lapping apparatus and lapping method

摘要

In a lapping apparatus including upper and lower lapping turn tables, and disc-shaped workpiece holding fittings which are held rotatably between the upper and lower lapping turn tables and defines a plurality of receiving holes in which flat workpieces are located in the receiving holes, respectively, and the flat workpieces are lapped while the workpieces are moved together with the workpiece holding fittings relative to the upper and lower lapping turn tables, the thickness of the workpiece holding fittings is set to be thinner than a finished thickness of the workpieces with a difference between the thickness of the workpiece holding fittings and the finished thickness of the workpieces being 70 mu m or more.