| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition used in semiconductor encapsulation having excellent solder-crack resistance and heat-cycle resistance. SOLUTION: The semiconductor device is provided wherein a piezoresistance element is encapsulated by the epoxy resin composition composed of an epoxy resin, a phenol resin, an inorganic filler and a cure accelerator. The characteristic of the epoxy resin composition is that the piezostress value (δX2+δY2)1/2 is under 200 N/mm2.
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