| 摘要 |
PROBLEM TO BE SOLVED: To prevent disconnection even if thermally expanded, by taking measures against thermal expansion of substrates when the substrates remarkably differing in a coefficient of thermal expansion such as a glass substrate for a flat display cell and a PCB substrate are connected. SOLUTION: Between and on both sides of 1st through 4th TCPs 16a-16d, 1st through 5th through-holes 18a-18e are formed on the driving circuit substrate 14, while 1st through 5th fixed pins 23a-23e are projected. The driving circuit substrate 14 is superimposed on a frame 20a, and the 1st through 5th fixed pins 23a-23e on the frame 20a are inserted into the 1st through 5th through-holes 18a-18e of the driving circuit substrate 14, and the thermal expansion of the driving circuit substrate 14 caused by temperature changes is diffused and restricted, thereby preventing stress concentration on the specific TCPs 16a-16d.
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