METHOD FOR FORMING ALUMINUM METAL WIRING

摘要

PURPOSE: A method for forming an aluminum metal wiring is provided to improve reflectance uniformity, and notch and void resistance in an aluminum alloy by improving surface topology. CONSTITUTION: An aluminum film(11) is deposited on a semiconductor substrate. An aluminum nitride film(12) is formed by nitridation of the surface of the aluminum film(11) while restraining the topology of the substrate. Then, an anti-reflective coating(13) is formed on the entire surface of the resultant structure. Preferably, a TiN layer is used as the anti-reflective coating(13).