HEAT-RESISTANT FILM AND PRINT CIRCUIT BOARD USING IT AS SUBSTRATE, AND METHOD OF MANUFACTURING THEM

摘要

PROBLEM TO BE SOLVED: To provide a heat resistant film suitable for an electronics member or the like and particularly having improved edge tearing strength and a print circuit board using it as a substrate, and a method of manufacturing them. SOLUTION: The heat resistant film comprises a mixture of 100 pts.wt. of a resin composition and an inorganic filler in a range of 5-50 pts.wt., which is treated for crystallization. The resin composition consisting of 70-30 wt.% of a polyarylketone resin (A) has a crystal melting temperature of 260 deg.C and 30-70 wt.% of a non-crystalline polyetherimide resin (B), wherein when the film is heated at a rate of 10 deg.C/min. in a differential scanning calorimetry at least two endothermic peaks are observed, and the two endothermic peaks of which appear at a lower temperature than the peak due to crystal melting of the polyarylketone resin (A) at 260 deg.C.