发明名称 HOT MELT COMPOSITION AND METHOD FOR ASSEMBLING PARTS THEREWITH
摘要 PROBLEM TO BE SOLVED: To provide a hot melt composition and a method for assembling parts therewith to solve the problem that the conventional way of sealing by placing molded packings or putting sealing agents between parts requires skill and poses troubles in the workability, and to solve the problem of disassembling efficiency that makes it practically impossible to recycle the parts. SOLUTION: By using a hot melt composition comprising, as indispensable components, a specific high molecular-weight styrene block copolymer, a specific polyphenylene ether resin and a viscosity regulator, it is possible to bond parts by melting the composition and applying it to one of the parts and bond it to the other part or the like. Accordingly, it is possible to bring parts with the composition applied thereon into working sites, working lines, etc., and easily perform bonding them to the counterparts or the like for assembling. The parts can be recycled, since they are easily disassembled.
申请公布号 JP2002105423(A) 申请公布日期 2002.04.10
申请号 JP20000295339 申请日期 2000.09.28
申请人 AICA KOGYO CO LTD 发明人 TOMITA ATSUSHI;IWATSUKA YUJI
分类号 C09J153/00;C09J153/02;C09J171/12;(IPC1-7):C09J153/00 主分类号 C09J153/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利