| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC tray composition that comprises a polyphenylene ether resin as an essential resin constituent, maintains kneadability and granulation at satisfactory levels, is excellent in conductivity and antistatic property, prevents mounted items from being soiled with peeled carbon black, and have excellent resistance to scuffing, and to provide an IC tray obtained by forming the resin composition. SOLUTION: The IC tray resin composition contains: (A) a polyphenylene ether resin, (B) carbon fiber having volume resistivity that is lower than or equal to 10E2Ω.cm, and (C) nonconductive inorganic filler. The content of (A) is 100 parts by weight, the content of (B) is 5 to 40 parts by weight, and the content of (C) is 50 to 120 parts by weight.
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