| 摘要 |
PROBLEM TO BE SOLVED: To provide a cured product of resin having excellent moisture resistance and low dielectric constant and dielectric loss tangent and extremely useful when using for insulating materials for electric and electronic parts (e.g. semiconductor sealing material having high reliability) and laminated boards (e.g. printed circuit board) and various composite materials including CFRP, adhesives, coatings, etc. SOLUTION: This epoxy resin is obtained by glycidylating a mixture of phenol compounds containing >=50 wt.% compound represented by the following formula (1) [wherein R independently represents any of a 1-10C alkyl group, a cycloalkyl group and phenyl group and total of carbon numbers in whole R is larger than (n+3); (n) is an average value and exhibits a real number]. This epoxy resin composition comprises the synthesized epoxy resin composition. This cured product of the epoxy resin composition is obtained by curing the epoxy resin composition.
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