| 摘要 |
A processing apparatus is provided for cleaning a wafer W. In the apparatus, a carbonated solution in the form of mist is ejected onto the wafer W through a nozzle 41, so that the film of carbonated solution, i.e., a conductive liquid film is formed on the wafer W. Next, a pure water highly pressurized by a jet pump 47 is ejected on the wafer W for cleaning it. The film of carbonated solution prevents devices built on the wafer W from being broken electrostatically. A liquid passage 52 from a supply source 51 of the carbonated solution up to the nozzle 41 is made of material which does not dissolve its metallic components into the carbonated solution in spite of the contact of the liquid passage 52 with the carbonated solution.
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