发明名称 Mounting structure for mounting power elements to heat dissipation member
摘要 A power element mounting structure for use in a brushless motor comprises a circuit board; a spring plate of metal, the spring plate being resiliently mounted, through a first mounting structure, on the circuit board keeping a given space therebetween; a plurality of power elements disposed on the spring plate to form a semi-assembled unit; a heat dissipation member of metal having a plurality of heat dissipation fins on an outer surface thereof, the heat dissipation member being mounted, through a second mounting structure, on the semi-assembled unit in such a manner that an inner surface thereof faces toward the power elements; and a plurality of spring pieces defined by the spring plate, the spring pieces being arranged to press the power elements against the inner surface of the heat dissipation member.
申请公布号 US6370026(B2) 申请公布日期 2002.04.09
申请号 US20010754198 申请日期 2001.01.05
申请人 CALSONIC KANSEI CORPORATION 发明人 SUNAGA HIDEKI;OHIRA SHIGENORI;SANO NARIHITO;YAMADA KAZUNORI;OBA TAKESHI
分类号 H01L23/40;H02K11/04;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/40
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